| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method and device of improving polishing in-plane uniformity in relation to a substrate to be polished. <P>SOLUTION: After performing an abrasive material supply treatment ST2 for supplying an abrasive material between abrasive cloth 8 and the substrate 1 to be polished and rotating the abrasive cloth 8, while pressing the abrasive cloth 8 on the substrate 1 by first pressing force, a treatment including a polishing treatment ST3 for polishing the substrate 1 by rotating the substrate 1 by second pressing force larger than the first pressing force while pressing the substrate 1 on the abrasive cloth 8 is performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
