| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a fingerprint detection accuracy by means of improved densification of a fingerprint detecting element and reducing the production cost. <P>SOLUTION: In a fingerprint sensing device which senses a finger print based on heat transmission characteristics of crests and troughs of fingerprints in the fingerprint detecting element when a finger is placed on the device which has a plurality of fingerprint detecting elements and a fingerprint detecting means with a laminated wiring board connected to each fingerprint detecting element, the fingerprint detecting element is composed of a pin diode on which a film made of an amorphous semiconductor or a microcrystal glass semiconductor is laminated, or a Schottky diode on which a film made of the amorphous semiconductor or microcrystal glass semiconductor and a metal material is laminated. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
