发明名称 METHOD FOR FORMING FINE COPPER PARTICLE SINTERED PRODUCT TYPE OF ELECTRIC CONDUCTOR HAVING FINE SHAPE, METHOD FOR FORMING FINE COPPER WIRING AND THIN COPPER FILM USING SAID METHOD
摘要 A method for forming a fine copper particle sintered product type of electric conductor having a fine shape, wherein a fine pattern is drawn by the use of a dispersion of copper particles having an oxide film on the surface thereof, and then, at a relatively low temperature, fine copper particles having an oxide film layer on the surface thereof or fine copper oxide particles in the resultant pattern are subjected to a reduction treatment and the resultant fine copper particles are sintered, in an embodiment, a dispersion of fine copper particles having an oxide film layer on the surface thereof or fine copper oxide particles having an average particle diameter of 10 mum or less is applied on a substrate, fine particles in the resultant applied layer are heated to a temperature of 350°C or lower in an atmosphere containing a vapor or gas of a compound having reducing ability to thereby reduce the oxidized film through the reduction utilizing said compound having reducing ability as a reducing agent, and then, carrying out a series of heating steps comprising repeating a heating treatment combining a oxidation treatment for a short time and a re-reduction treatment and forming a sintered product from the resultant copper particles. A fine copper particle sintered product type of electric conductor having a fine shape formed by the above method exhibits excellent elctroconductivity.
申请公布号 KR20060021310(A) 申请公布日期 2006.03.07
申请号 KR20057021515 申请日期 2005.11.11
申请人 HARIMA CHEMICALS, INC. 发明人 ITOH DAISUKE;IZUMITANI AKIHITO;HATA NORIAKI;MATSUBA YORISHIGE
分类号 H05K3/10;H01B1/22 主分类号 H05K3/10
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