| 摘要 |
A system and method for including a thin and flexible RFID tag in the molding process for handlers, transporters, carriers, trays and like handling devices utilized in the semiconductor and sensitive electronic component processing and handling industries. The RFID tag of predetermined size and shape is generally bonded or encapsulated between two thermopolymer film layers to create an RFID tag laminate. This RFID tag laminate is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable molten resin material such that upon completion of the film insert molding process, the RFID tag laminate is integrally bonded to at least a portion of the molded handling device, or handling device component/part.
|
