发明名称 RIBBON BONDING
摘要 A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
申请公布号 WO2004100258(A3) 申请公布日期 2006.02.23
申请号 WO2004US13025 申请日期 2004.04.28
申请人 ORTHODYNE ELECTRONICS CORPORATION;LUECHINGER, CHRISTOPH B. 发明人 LUECHINGER, CHRISTOPH B.
分类号 H01L21/60;H01L23/36;H01L21/607;H01L23/495;H01L23/66 主分类号 H01L21/60
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