| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of a wiring board incorporating an electric element in which the inductance is reduced effectively. SOLUTION: Each of a plurality of electric elements 23 is provided with first and second outer electrodes 27a, 27b and a first conductor layer 17 and a second conductor layer are formed, at a predetermined interval in the thickness direction, in an insulation board 11 between the electric element 23 and the surface of the insulation board 11. The first and second outer electrodes 27a, 27b of the plurality of electric elements 23 are connected electrically with the first and second conductor layers through a via hole conductor 15. Furthermore, a pair of closest via hole conductors 15 are connected, respectively, with different conductor layers 17, 19 between adjacent electric elements thus reducing inductance of a wiring board A incorporating an electric element. |
