发明名称 Woven mesh interconnect
摘要 <p>An electrical interconnect (10) is comprised of a woven mesh in which an array of parallel wires (20) is retained in spaced relation by a transverse array of nonconducting strands (30), the mesh being enclosed or encased within a resilient matrix. The conductive wires are on a close pitch to yield greater current carrying capacity and achieve a lower more stable resistance. With this construction a great number of wires are in contact with each contact pad to yield greater current carrying capacity and corresponding lower resistance. The closer pitch wires also provide greater redundancy of contact points. This structure can be custom configured in as many layers or in a variety of shapes as is desirable to achieve a given electrical performance. The woven mesh can be wrapped around a shaped substrate to provide electrical connections in a desired shape. The woven mesh interconnect can be integrated as part of a boot, wherein the boot receives an electrical device therein and the woven mesh interconnect provides electrical connection from the device within the boot to outside the boot. The woven mesh interconnect can be layered and shaped to form an interconnect which not only provides electrical interconnection but also provides a biasing force due to the shape of the device. <IMAGE></p>
申请公布号 EP0901191(B1) 申请公布日期 2006.02.22
申请号 EP19980307198 申请日期 1998.09.07
申请人 THOMAS & BETTS INTERNATIONAL, INC. 发明人 STRANGE, ANDREW H.;MILLAY, ARTHUR;BUCHOFF, LEONARD S.;MACINNES, STEVEN K.;RASSIER, DANIEL W.
分类号 H01R11/01;H01R13/24;H05K1/00 主分类号 H01R11/01
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