发明名称 GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a grinding device capable of reducing a damaged layer of a workpiece and easily controlling the position of a workpiece support base to allow automation of the grinding device. SOLUTION: A workpiece support base feeding means 4 of the grinding device 1 is provided with a moving base 11 advanced in a parallel direction to a machined surface of the workpiece W while supporting the workpiece support base 3 movably backward in the parallel direction to the machined surface of the workpiece W; a clamp actuator 14 serving as an electromagnetic clamping means for connecting the moving base 1 to the workpiece support base 3 with electromagnetic force corresponding to a current value with the flow of a required control current; a preload spring 15 for energizing the moving base 11 in a retreating direction; a linear scale 17 serving as a relative displacement detecting means for measuring the relative displacement of the workpiece support base 3 to the moving base 11; and a control means for controlling the control current of the clamp actuator 14 according to the quantity of displacement obtained by the linear scale 17. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005230965(A) 申请公布日期 2005.09.02
申请号 JP20040042682 申请日期 2004.02.19
申请人 KOYO SEIKO CO LTD 发明人 HATTORI AKIRA;YAMADA HIROHISA
分类号 B23Q5/28;B23Q17/22;B24B7/02;B24B47/02;(IPC1-7):B24B47/02 主分类号 B23Q5/28
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