| 摘要 |
An apparatus for testing a semiconductor device is disclosed. According to the present invention, the apparatus includes a pair of input pins, a first conductive wire, a second conductive wire, a driver and a terminator. A device-under-test (DUT) is connected to one of the pair of input pins. The first conductive wire and the second conductive wire are connected in parallel between the pair of input pins. The driver is coupled to the first conductive wire via a third conductive wire, and the terminator is coupled to the second conductive wire via a fourth conductive wire.
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