| 摘要 |
PROBLEM TO BE SOLVED: To provide a preliminary solder method in which in the preliminary solder process of a part insertion hole, the unevenness of solder wetting does not occur, and the part insertion hole is not clogged by solder. SOLUTION: The preliminary solder method has a coating step of coating a land 12 which is provided on a circuit board 11 and has a part insertion hole 14, with cream solder 13; a mounting step of, after this coating step, aligning the part insertion hole 14 and a suction hole 16 to the upper face of a hard stage 15 having the suction hole 16, to mount the circuit board 11; and a removing step of, after this mounting step, removing an unwanted solder in the part insertion hole 14 by using at least either method in which the cream solder 13 is melted while sucking it from the back side of the hard stage 15, or gas is injected from upward of the part insertion hole 14. COPYRIGHT: (C)2006,JPO&NCIPI
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