SELECTIVE ENCAPSULATION OF ELECTRONIC COMPONENTS

摘要

A method for the selective encapsulation (14) of electronic components (10) on a printed circuit board (12) comprising, in one embodiment, the steps of delivering the printed circuit board to an encapsulating nest at room temperature; damming the target areas with a dam resin having a latent curing agent and deposited in the shape of walls of predetermined heights, according to the desired fill heights; dispensing a fill resin to fill the dammed areas; and curing the dam and fill resins for a suitable amount of time. In a different embodiment, the invention comprises the additional steps of laying resin beads (20), each in a position corresponding to the footprint of each target component (22); and of positioning the target components over the beads and soldering the components.