发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting conductive paste which can form a conductive film with extremely high conductivity without decreasing adhesive property or film strength. SOLUTION: The conductive paste includes at least (A) a conductive metal powder based on silver, (B) at least one kind selected from the group consisting of a silver carbonate powder, a silver oxide powder, and the silver salt of a fatty acid having total 1-24 carbon atoms, (C) an alkali metal ion, and (D) a binder resin including a thermosetting resin; and the weight ratio of (C) to (A) is 10-3,000 ppm. In the conductive paste, by blending the alkali metal ion controlled by the particular ratio with the component (B), without decreasing electric characteristics and reliability, the conductive film with high conductivity can be formed by heat treatment at low temperatures of around 100-250°C. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006049147(A) 申请公布日期 2006.02.16
申请号 JP20040229699 申请日期 2004.08.05
申请人 SHOEI CHEM IND CO 发明人 ENDO TAKASHI;BABA NORIHIRO;AKIMOTO YUJI
分类号 H01B1/22;C08K3/08;C08K3/22;C08L63/00;C08L101/00 主分类号 H01B1/22
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