| 摘要 |
PROBLEM TO BE SOLVED: To provide a stacked memory by which signal waveform is hardly deteriorated even in a high-speed signal transmission system. SOLUTION: The stacked semiconductor device (10) is provided with several semiconductor chips (14) and at least one substrate (12/13). The stacked semiconductor device (10) is provided with a resistor (27/50) on its substrate (12/13). At least one of wires which are connected to the semiconductor chips (14) is connected to the outside of the stacked semiconductor device (10) through the resistor (27). COPYRIGHT: (C)2006,JPO&NCIPI
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