A COOLING SYSTEM FOR ELECTRONIC SUBSTRATES,申请号WO2005IB52461-传众专利搜索

发明名称	A COOLING SYSTEM FOR ELECTRONIC SUBSTRATES
摘要	<p>The present invention relates to a cooling system for an electronic substrate comprising a heat transfer fluid (4, 10). The heat transfer fluid (4, 10) is arranged to flow along a path (5, 11, 12) by capillary force.</p>
申请公布号	WO2006016293(A1)	申请公布日期	2006.02.16
申请号	WO2005IB52461	申请日期	2005.07.21
申请人	KONINKLIJKE PHILIPS ELECTRONICS N.V.;NICOLE, CELINE;LASANCE, CLEMENS, J., M.;PRINS, MENNO, W., J.;BARET, JEAN-CHRISTOPHE;DECRE, MICHEL, M., J.	发明人	NICOLE, CELINE;LASANCE, CLEMENS, J., M.;PRINS, MENNO, W., J.;BARET, JEAN-CHRISTOPHE;DECRE, MICHEL, M., J.
分类号	F28D15/04;F28D15/06	主分类号	F28D15/04
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