PAD METALLISATION PROCESS

摘要

A method of treating an electronic component comprising an insulating substrate with conductive areas formed thereon to metallise the surface of at least one of the conductive areas comprises the steps of: a) applying a protective barrier to areas of the component which are nit to be treated, b) cleaning the unprotected areas of the component, c) applying a layer of nickel to the cleaned areas, d) applying a layer of gold to the nickel coated areas, and e) removing the protective barrier. An electronic component comprising an insulating substrate with at least one conductive area formed thereon, wherein said at least one conductive area is coated with a layer of nickel, the layer of nickel being in turn coated with a layer of gold is also claimed.