| 摘要 |
A sealed spray cooling system for reducing coolant loss within thermal management systems. The sealed spray cooling system includes a spray housing defining a spray chamber having at least one atomizer and a seal member attached to the spray housing about the spray chamber for sealing against a semiconductor forming a sealed spray area. Alternatively, the spray unit is comprised of a first member, a second member having at least one atomizer, the second member pivotally attached to the first member forming an interior cavity between thereof, and a seal member attached to the second member for sealing against a semiconductor within the first member thereby forming a sealed spray area. A vacuum manifold is preferably fluidly connected to the spray cavity thereby reducing the pressure within the spray cavity.
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