发明名称 |
Wiring board and soldering method therefor |
摘要 |
A circuit board for surface mounting by solder flow an electronic component having narrow lead pitches, the board having a first solder leading land having a first side and located on the circuit board adjacent to a land for mounting an electronic component, and a second solder leading land located next to the first solder leading land and opposite the first side of the first solder leading land. A method for flow soldering a surface mounted electronic component on such a circuit board, wherein the second solder leading land is positioned at a rear end of the circuit board against a direction of a movement of the circuit board when the circuit board moves toward a solder flow.
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申请公布号 |
US6998861(B2) |
申请公布日期 |
2006.02.14 |
申请号 |
US20030311993 |
申请日期 |
2003.02.11 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., INC. |
发明人 |
NAKAI MITSUHISA;KURIYAMA KEIICHI;KYOGOKU AKIHIRO;NAKAMOTO YOSHINAO;TANIGUCHI KOJI;HIGASHI HIROAKI |
分类号 |
G01R31/02;H05K1/11;H05K3/34 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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