| 摘要 |
In a semiconductor flip-chip package having a semiconductor die 104 as part of a substrate assembly, a lid 110 (or lid assembly) and substrate 102 are supported with respect to each other so as to prevent tilting and teetering of the lid during socketing, testing, application of heat sinks, and so forth. Yet the lid and substrate do not adhere, so as to reduce cracking of solder joints due to thermal cycling induced by repeated system power on-off. In some embodiments, an adhesion prohibitor 315, 325 may be explicitly applied so that a support 314, 324 does not adhere to both lid and substrate; in other embodiments, the support 314, 324 may be prevented from adhering to both lid and substrate by a separate curing step. That is, fabrication methods (FIGS. 4 A, 4 B) involving an adhesive prohibitor may involve a single curing step for the support material and a lid-attach adhesive 112 (such as a polymer), while fabrication methods (FIGS. 5 A, 5 B) not involving an adhesive prohibitor involve two separate curing steps. The arrangements and fabrication methods may be applied to many package types, including ball grid array (BGA) and land grid array (LGA) packages.
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