| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board which can improve the thermal shock of the ceramic board with a metallic circuit or durability over a heat history, namely, heat shock-proof characteristics or heat cycle-proof characteristics, and to provide an electric apparatus. SOLUTION: In a ceramic circuit board 11 which carries out the pasting formation of a metal plate 23 to both the principal surfaces of a ceramic substrate 21, the side edge 25 of the ceramic substrate 21 is formed inside the side edge 27 of the metal plate 23. COPYRIGHT: (C)2006,JPO&NCIPI
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