发明名称 SEMICONDUCTOR WAFER AND RETICLE, METHOD FOR CARRYING OUT EXPOSURE BY USING THE SAME AND EXPOSURE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To accurately control the scanning speed of the rays of light to scan a semiconductor wafer in accordance with the pattern of a lower layer in scan-and-repeat type exposure. <P>SOLUTION: An alignment pattern 10 is substantially formed in parallel to the scanning direction of the rays of light to scan in exposure in one scribe line 6 positioned at the rightmost end of the exposure region 4 of a semiconductor wafer 1. The alignment pattern 10 is formed by arraying fine patterns 8 at predetermined positions. The fine patterns 8 are arranged in two rows, and are substantially arranged with equal intervals in the both rows so that the intervals of the adjacent fine patterns 8 in the both rows can be made different from each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006041155(A) 申请公布日期 2006.02.09
申请号 JP20040218348 申请日期 2004.07.27
申请人 RICOH CO LTD 发明人 OTSUKA MASAYA
分类号 H01L21/027;G03F9/00 主分类号 H01L21/027
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