| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a multi-chip stack structure which hardly allows wire shorts to occur. SOLUTION: The method of manufacturing the semiconductor device comprises processes of: preparing a wiring mother board which has a plurality of product formation regions with a chip mounting portion, and wire connection pads 5 formed on a first surface 2a and base electrodes 6 formed on a second surface 2b; fastening a semiconductor chip 17 of a lower stage on the chip mounting portion, and connecting the electrodes and the pads 5 by wires 20; applying an insulating resin 21 so as to selectively cover these and then making the surface of the insulating resin 21 into a flat surface 22 to form a coating resin layer 21; fastening a semiconductor chip 24 of an upper stage on the flat surface 22 and connecting the electrodes and the pads 5 by wires 26; forming an insulating resin layer so as to cover the coating resin 21 and the semiconductor chip 24, and wires 26; forming external electrode terminals 4 on the base electrodes 6; and dividing the wiring mother board and the resin layer lengthwise and crosswise into individual product formation regions. COPYRIGHT: (C)2006,JPO&NCIPI |
