| 摘要 |
The invention concerns a microwave miniature package designed to be surface-mounted on a host circuit. The package comprises: a silicon chip (100) having an active surface (102) and a rear surface opposite the active surface, the active surface comprising active elements (108), electrical conductors of the active surface (110), the rear surface comprising electrical conductors of the rear surface (112); electrical contact pads (112), for transferring the package onto the host circuit. The electrical contact pads for transferring the package are connected to the electrical conductors of the rear surface of the chip, the electrical conductors of the active surface of the chip and those of the rear surface of the chip being connected by plated through-holes (116). The package is closed with a dielectric material (118) coating at least one active surface of the chip. The invention is applicable to surface-mounted microwave miniature packages. |
