| 摘要 |
A semiconductor device has first and second semiconductor chips 101, 111 comprising electronic circuit elements located at an inner part of the chip and first connection terminals 117, 118 located on an upper surface of the inner part of the chip. One of the chips has second connection terminals 116 located at a peripheral part of the chip. The first and second semiconductor chips are mounted one on top of the other to form the device, connected together (via integrated interface circuits) by the first connection terminals 117, 118 of the first and second semiconductor chips, and wherein the second connection terminals 116 of the first semiconductor chip provide external connections to the device. The invention enables SoC resources to be increased based on the System-in-Package (SiP) approach by duplicating identical chip components into a single package. The chip 111 may initially be formed identical to the chip 101, but subsequently have its peripheral part carrying terminals 116 removed. Alternatively the chips 101 and 111 may have different designs but with the same configuration of terminals 117, 118. |
