发明名称 |
High performance interposer for a chip package using deformable button contacts |
摘要 |
An interposer includes an array of buttons on a carrier having a proximity to each other that allows contact between two adjacent buttons to occur when at least one of the two adjacent buttons is axially compressed above a predetermined threshold. The chip package includes a chip having a first surface and a second surface, a printed circuit board having a first surface and a second surface, and an interposer having an array of buttons between the chip and the printed circuit board. The first surfaces are closer to each other than the second surfaces.
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申请公布号 |
US6994570(B2) |
申请公布日期 |
2006.02.07 |
申请号 |
US20040765042 |
申请日期 |
2004.01.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KWARK YOUNG HOON |
分类号 |
H01R4/58;H01L23/48;H01L23/498;H01R12/00;H05K3/32 |
主分类号 |
H01R4/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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