发明名称 Bonded structure using reacted borosilicate mixture
摘要 Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide interface formed between the RBM and substrate during a high temperature reaction process. An oxide interface is also formed with oxidizable bodies to provide further mounting strength. The RBM is a B<SUB>2</SUB>O<SUB>3</SUB>-SiO<SUB>2 </SUB>mixture, with the B<SUB>2</SUB>O<SUB>3 </SUB>portion a function of the reaction temperature and desired bonding strength and viscosity.
申请公布号 US6995691(B2) 申请公布日期 2006.02.07
申请号 US20010783831 申请日期 2001.02.14
申请人 HEETRONIX 发明人 PARSONS JAMES D.
分类号 G01J5/04;H01L23/29;G01J5/02;G01J5/12;G01J5/14;H01L21/58;H01L21/66;H01L23/31;H01L23/544 主分类号 G01J5/04
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