| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a passive element chip built-in type printed circuit board which is devised so that a mounted chip does not go through a bottom of an unthrough hole by forming the unthrough hole in a predetermined insulating layer, leaving or removing a copper clad layer on the bottom of unthrough hole, and mounting the passive element chip. <P>SOLUTION: The unthrough hole for mounting the passive element chip is formed on the base material laminated on a core layer, and the passive element chip is mounted in the unthrough hole after a circuit pattern is formed on the copper clad layer of the base material. The insulating layer or the other base material composed of the insulating layer and the copper clad layer of one side is laminated on the base material where the passive element chip is mounted, is heated, and is pressed. A via hole capable of electrically connecting between the electrode of the passive element chip and the outside is worked, the via hole is plated with copper, then , a circuit pattern is formed outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
