| 摘要 |
<P>PROBLEM TO BE SOLVED: To lessen a melt risk by suppressing heat generation at a terminal connected to a switch circuit in a semiconductor device of a grid array terminal structure. <P>SOLUTION: The output end of a switch circuit built in a semiconductor device of a grid array terminal structure such as a BGA is connected to a plurality of terminals in grid array terminals. Thereby a current flowing through one array terminal is reduced to an allowance current level or to a lower level. One or more other terminals are arranged between the plurality of terminals, and all the plurality of terminals are arranged to the outermost peripheral terminal of the grid array terminals. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
