发明名称 |
METHOD OF CONNECTING FLAT SURFACE MULTIPLE CONDUCTOR AND ELECTRIC ELECTRONIC PART INCLUDING PART CONNECTED BY METHOD OF CONNECTION |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of connection which can perform repair easily while a flat surface multiple conductor made minute is certainly connectable. SOLUTION: The method of connecting the corresponding conductor of the flat surface multiple conductor performs line-up arrangement, grows a plurality of semiconductors into abbreviate flat member by overlaying, and includes a noble metal layer as an outermost layer of a metal for constituting certainly the semiconductor to the pair of the overlay region of the flat surface multiple conductors. A thermosetting adhesive composition region includes at least one conductor of the pair of the flat surface multiple conductors. After aligning correspondingly the semiconductor, it is a heating overlay region to a temperature with the above noble metal layer lower than the temperature for performing melting and sticking it by a pressure. While the electric connection of the corresponding semiconductor is performed by a solid state welding or contact, the overlay regions other than the semiconductor is bonded with the above thermosetting adhesive composition. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006024751(A) |
申请公布日期 |
2006.01.26 |
申请号 |
JP20040201633 |
申请日期 |
2004.07.08 |
申请人 |
THREE M INNOVATIVE PROPERTIES CO |
发明人 |
KAWATE YOSHIHISA;KAWATE KOICHIRO |
分类号 |
H05K3/36;H01R43/02;H05K1/14 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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