发明名称 METHOD OF CONNECTING FLAT SURFACE MULTIPLE CONDUCTOR AND ELECTRIC ELECTRONIC PART INCLUDING PART CONNECTED BY METHOD OF CONNECTION
摘要 PROBLEM TO BE SOLVED: To provide a method of connection which can perform repair easily while a flat surface multiple conductor made minute is certainly connectable. SOLUTION: The method of connecting the corresponding conductor of the flat surface multiple conductor performs line-up arrangement, grows a plurality of semiconductors into abbreviate flat member by overlaying, and includes a noble metal layer as an outermost layer of a metal for constituting certainly the semiconductor to the pair of the overlay region of the flat surface multiple conductors. A thermosetting adhesive composition region includes at least one conductor of the pair of the flat surface multiple conductors. After aligning correspondingly the semiconductor, it is a heating overlay region to a temperature with the above noble metal layer lower than the temperature for performing melting and sticking it by a pressure. While the electric connection of the corresponding semiconductor is performed by a solid state welding or contact, the overlay regions other than the semiconductor is bonded with the above thermosetting adhesive composition. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006024751(A) 申请公布日期 2006.01.26
申请号 JP20040201633 申请日期 2004.07.08
申请人 THREE M INNOVATIVE PROPERTIES CO 发明人 KAWATE YOSHIHISA;KAWATE KOICHIRO
分类号 H05K3/36;H01R43/02;H05K1/14 主分类号 H05K3/36
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