Electronic component with an adhesive layer and method for the production thereof

摘要

The present invention relates to an electronic module having a layer of adhesive between metallic surfaces of components of the module. The metallic surfaces are arranged facing one another. The adhesive of the layer of adhesive includes agglomerates of nanoparticles, which form paths, surrounded by an adhesive base composition, in the adhesive base composition. Furthermore, the invention relates to a process for producing the module.