发明名称 CAMERA MODULE
摘要 <p>A camera module for mobile device is reduced in size and production cost. CCDs, which are photoelectronic transducers, are formed in a surface of a semiconductor chip (60) composing an image sensor (61), and an IR filter (90) is bonded with an adhesive to cover the surface of the semiconductor chip (60). The IR filter (90) has a filtering function in addition to a function to support the semiconductor chip (60). The IR filter (90) is obtained by vacuum deposition of metal on a glass material or incorporating copper particles into a glass material, and implements both filtering function and chip-supporting function. <IMAGE></p>
申请公布号 KR100543854(B1) 申请公布日期 2006.01.23
申请号 KR20030092236 申请日期 2003.12.17
申请人 发明人
分类号 G02B5/20;G02B5/22;G03B11/00;H01L23/00;H01L27/14;H01L27/146;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335;H04N5/369 主分类号 G02B5/20
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