发明名称 Polyamide-based multilayer structure for covering substrates
摘要 The present invention relates to a polyamide-based multilayer structure comprising in succession: an upper layer made of a transparent polyamide coming from the condensation: either of a lactam or of an alpha,Omega-amino acid having at least 9 carbon atoms or of a diamine and of a diacid, at least one having at least 9 carbon atoms; a lower layer capable of adhering to the substrate and optionally, an intermediate tie layer (also called a central layer) between the upper layer and the lower layer, each of the layers exhibiting thermomechanical behaviour (strength as a function of temperature) sufficiently similar to allow the structure to be easily formed under the effect of the temperature. The invention also relates to the objects consisting of these substrates covered with these structures, the lower layer being placed against the substrate.
申请公布号 US2006014035(A1) 申请公布日期 2006.01.19
申请号 US20050154420 申请日期 2005.06.16
申请人 MONTANARI THIBAUT;LACROIX CHRISTOPHE;SILAGY DAVID;MAUFFREY JOCELYN;KERVENNAL ROPARZ;BAUMERT MARTIN 发明人 MONTANARI THIBAUT;LACROIX CHRISTOPHE;SILAGY DAVID;MAUFFREY JOCELYN;KERVENNAL ROPARZ;BAUMERT MARTIN
分类号 B32B27/08 主分类号 B32B27/08
代理机构 代理人
主权项
地址