MANUFACTURING METHOD AND SOLDERING METHOD FOR ELECTRONIC DEVICE AND HEAT SHIELDING TOOL

摘要

A manufacturing method and a soldering method for electronic devices, wherein a heat shielding tool (20) having a heat absorbing member (11) is placed on a surface mounting part (12) in the state of the heat absorbing member (11) coming into contact with the surface mounting part (12) and the surface mounting part is heated for soldering. Thus, even if a solder with a high reflow temperature is used, a low heat resistant part with a heat resistant temperature of approx. 220°C can be mounted.