| 摘要 |
A packaging system and methods are disclosed for protecting an electronic component and the cavity of a carrier tape. The packaging system includes a cover tape having a protective layer and a film layer attached thereto. A method for protecting components positioned in the cavities of a carrier tape includes attaching a compressible protective layer to a first surface of the cover tape facing away from the cavity, and sealing the cover tape on at least a pair of bonding zones of the carrier tape.
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