| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding apparatus which can automatically correct a CTD (camera tool distance) even during the continuous operation of the apparatus. <P>SOLUTION: The wire bonding apparatus includes a tool 6 for bonding a ball 8 made of a wire 7 to a work, a camera off-set by the CTD to the tool 6 and arranged to detect a position for detecting the position of the work, a moving means (for example, an XY stage) for moving the tool 6 and the camera for detecting the position, and an optical unit for focusing the tool 6 or the ball 8 to the camera for detecting the position. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
