| 摘要 |
Resin moldings made of a composition which comprises a polyamide (A) consisting of two or more kinds of polyamide components, polyphenylene ether (B), and a partially hydrogenated block copolymer (C) obtained by partial hydrogenation of a block copolymer composed of an aromatic vinyl polymer block and a conjugated diene polymer block (which contains a copolymer (C-1) having a number-average molecular weight of 200,000 to 300,000) and in which the component (A) forms a continuous phase and the component (B) forms a dispersed phase in the continuous phase, with the component (C) being present in the continuous phase and/or the dispersed phase, characterized in that the surface areas of the component (A) appearing on the surface of the molding account for at least 80 % of the whole surface area of the molding; and a conductive resin composition comprising polyamide (A), polyphenylene ether (B), a block copolymer (C) composed of an aromatic vinyl polymer block and a conjugated diene polymer block, an electrically conducting carbonaceous material (D), and wollastonite particles (E).
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