EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is capable of hardening within a short time in a pressure welding step and forming a void-less, hardened resin layer excellent in adhesion property to improve manufacturing efficiency of a flip chip-packaged semiconductor device. SOLUTION: The epoxy resin composition contains an epoxy resin and a hardener and is in a liquid state at a room temperature, wherein an adduct of 2-methylimidazole and an alicyclic epoxy of formula (1) is used as the hardener. The use of the epoxy resin composition in flip chip packaging enables efficient manufacturing of the semiconductor device with a high operational reliability. COPYRIGHT: (C)2006,JPO&NCIPI