| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling device capable of eliminating damages on a dry resist film and a board when manufacturing a circuit board, and easily and reliably forming a peel-hooking portion. SOLUTION: The peeling device comprises a pressing member to hold an adhesive tape and press the adhesive tape against a corner part of a film, a tape feed system to feed the adhesive tape to the pressing member, and a pressing member driving system to move the pressing member along the spherical surface or the circumference around a predetermined point on the film after the adhesive tape is pressed against the corner part of the film. COPYRIGHT: (C)2006,JPO&NCIPI
|
