摘要 |
A cleaning method for use in an apparatus for manufacturing a semiconductor device includes: measuring components and concentration of each component of gas in a process chamber of an apparatus for manufacturing a semiconductor device, or selected from a group including gas in the chamber, a process gas in a gas inlet pipe, and gas in a gas outlet pipe; performing a prescribed process on a substrate in the chamber, while adjusting the components and the concentration of each component of the process gas, and of an atmosphere in the chamber, on the basis of the values measured, and taking the substrate from the chamber after the process is subjected; and generating and applying a cleaning gas on the basis of the values measured, the cleaning gas having such components and such concentration as to remove residues.
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