| 摘要 |
PROBLEM TO BE SOLVED: To provide an innovative package method presenting (50 microns or below) high density wiring system provided by mutually disposing wires in close proximity without inserting them into a substrate. SOLUTION: The high density electrical wiring system (10) has at least one substrate piece (12) and a flexible wound wiring assembly (14) extending from a first surface (16) to a second surface (18) of the substrate piece, and the flexible wound wiring is disposed at the periphery of an outer surface in the substrate piece. The second embodiment provides an array having the high density electrical wiring system provided with a plurality of substrates and the flexible wound wiring extending from each first surface to each second surface of a plurality of the substrates, and the flexible wound wiring is disposed at the peripheries of the outer surfaces in a plurality of the substrates. COPYRIGHT: (C)2006,JPO&NCIPI |
