| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring circuit capable of improving migration resistance particularly in a flexible printed circuit regarding a printed circuit with a circuit pattern in which electronic parts are mounted. SOLUTION: A circuit pattern 2 composed of a conductive material is formed on the surface of an insulating base material 1a composed of an insulating material. On the surface of the circuit pattern 2, an oxide film 2a is formed by thermal oxidation processing. On this circuit pattern 2, the press cure of a cover layer 3 composed of an adhesive-bond layer 3a and an insulating layer 3b is carried out for constituting a flexible printed circuit. COPYRIGHT: (C)2006,JPO&NCIPI |
