An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
申请公布号
WO2005110675(A3)
申请公布日期
2006.01.12
申请号
WO2005US15492
申请日期
2005.05.04
申请人
FREUDENBERG NONWOVENS;VANGSNESS, JEAN;HSU, OSCAR KAI CHI;POTNIS, ALAKA