发明名称 FLEXIBLE WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR CHIP MOUNTED FLEXIBLE WIRING BOARD AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board with a plurality of conductive wiring formed thereon having different linear width corresponding to terminals different in size, and to make uniform wiring thickness in a terminal connector without adopting any special working or manufacturing method. SOLUTION: In conductive wiring 12 in a flexible wiring board 10, the wiring leading part 12B of the conductive wiring 12 is provided with linear width(W1, W2) which are made different according to the size of the input/output terminal of a semiconductor chip, and the terminal connector 12A of the conductive wiring 12 is pattern-formed so that the linear width of the conductive wiring connected to at least one semiconductor chip can be made equal regardless of the difference of the linear width of the wiring leading part 12B. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006013230(A) 申请公布日期 2006.01.12
申请号 JP20040189980 申请日期 2004.06.28
申请人 TOHOKU PIONEER CORP 发明人 OHAZAMA HIDETAKA
分类号 H05K1/02;H01L21/60;H05K1/18;H05K3/18;H05K3/34 主分类号 H05K1/02
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