| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring circuit board wherein exfoliation of a conductor pattern and increase in the electric resistance of the conductor pattern can be avoided by preventing production of side etching, and to provide the wiring circuit board manufactured by the manufacturing method. SOLUTION: A base isolation layer 1 is prepared, and a first metallic thin film 2 comprising a titanium thin film or a zirconium thin film and a second metallic thin film 3 comprising a copper thin film are sequentially formed on the base isolation layer 1. Then a copper conductor pattern 4 is formed on the second metallic thin film 3 by electrolytic copper plating, and the second metallic thin film 3 exposed from the conductor pattern 4 is etched by using ferric chloride water solution. Thereafter, the first metallic thin film 2 is oxidized to form an isolation thin film 6 comprising the insulator of a titanium oxide thin film or zirconium oxide thin film, resulting in obtaining a flexible wiring circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
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