发明名称 PARTIAL PLATING EQUIPMENT AND PARTIAL PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide partial plating equipment where work can be safely performed while satisfactorily maintaining the work environment, and plating treatment can be stably performed in a short time with current efficiency highly held. SOLUTION: In the partial plating equipment 1, an insoluble anode 11 has a hollow structure having many pores allowing the outside and the hollow part to communicate with each other at the wall part, and is adhesively covered with a diaphragm 12, and further, a plating liquid holding body 13 is adhesively provided around the outer circumference of the diaphragm 12. In this way, an electrolysis gas generated at the surface of the anode 11 during plating treatment is collected from the pores 111 and is exhausted to the outside of the system through the hollow part 112, and further, anodization or the like are suppressed by the diaphragm 12, thus high current efficiency can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006009058(A) 申请公布日期 2006.01.12
申请号 JP20040184549 申请日期 2004.06.23
申请人 FURUYA KINZOKU:KK 发明人 SHIMAMUNE TAKAYUKI
分类号 C25D5/06;C25D3/50;C25D17/10;C25D17/12;C25D21/04 主分类号 C25D5/06
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