Polishing method

摘要

There are provided a work holding plate (38), wherein a plurality of suction holes (45) for vacuum chucking a work are formed in an adhering region on a work adhering surface of the work holding plate, each of the holes penetrating from the work adhering surface of the work holding plate to a rear surface thereof, and a method for adhering a work, where such a work holding plate with the plurality of fine holes opened in an adhering region thereof for vacuum chucking a wafer is used and the wafer is adhered with an adhesive on the work holding plate by evacuating air through the plurality of fine holes from the rear side of the work holding plate.