Heat-activatable adhesive tape for bonding electronic components and printed circuit boards

摘要

Heat-activable adhesive tape comprises adhesive containing acid modified or acid-anhydride-modified vinyl aromatic block copolymer, and epoxide compound. Independent claims are included for: (1) bonding plastic parts comprising adhering heat activable adhesive tape to the plastic parts; (2) bonding polyimide comprising adhering a heat activable adhesive tape to the polyimide;and (3) a device comprising plastic parts, electronic components, flexible printed circuits, and/or polyimide adhered to the heat activable adhesive tape.