| 摘要 |
<p>A paste composition containing an inorganic filler, a resin and a solvent, characterized in that the solvent comprises one or more solvents having a boiling point of 160°C or higher, the inorganic filler comprises a filler having an average particle diameter of 5 mum or less, and the total amount of the solvent is 25 wt % or less of the total amount of the composition; and a dielectric composition having an inorganic filler and a resin, characterized in that the inorganic filler comprises at least two types of inorganic fillers having different average particle diameters, wherein the maximum value of the above average particle diameters is 0.1 to 5 mum and is three times or more the minimum value of the average particle diameters. The paste composition and the dielectric composition can be used for preparing a highly dielectric composition which exhibits a low linear expansion coefficient and has a great capacitance.</p> |
