发明名称 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
摘要 A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.
申请公布号 KR20060002768(A) 申请公布日期 2006.01.09
申请号 KR20057015314 申请日期 2005.08.19
申请人 FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 发明人 NAIINI AHMAD A.;WEBER WILLIAM D.;WATERSON PAMELA J.;HSU STEVE LIEN CHUNG
分类号 G03F7/004;G03C1/492;G03C1/73;G03F7/023;G03F7/075;G03F7/30;G03F7/40 主分类号 G03F7/004
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