发明名称 |
NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS |
摘要 |
A positive photosensitive resin composition of at least one uncapped polybenzoxazole precursor polymer, at least one capped polybenzoxazole precursor polymer, at least one photosensitive agent and at least one solvent, use of such compositions to pattern an image on a substrate and the resulting relied patterned substrates and electronic parts therefrom.
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申请公布号 |
KR20060002768(A) |
申请公布日期 |
2006.01.09 |
申请号 |
KR20057015314 |
申请日期 |
2005.08.19 |
申请人 |
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. |
发明人 |
NAIINI AHMAD A.;WEBER WILLIAM D.;WATERSON PAMELA J.;HSU STEVE LIEN CHUNG |
分类号 |
G03F7/004;G03C1/492;G03C1/73;G03F7/023;G03F7/075;G03F7/30;G03F7/40 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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