发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition having an extremely excellent low out gas property, and also excellent in mechanical properties such as tensile stretch, etc., and characteristics such as a low water absorption, heat resistance, sliding property, chemical resistance, etc. SOLUTION: This polyamide resin composition consists of (a) dicarboxylic acid unit containing 50-100 mol% terephthalic acid unit and (b) diamine unit containing 60-100 mol% 1,9-nonanediamine and/or 2-methyl-1,8-octanediamine unit, and also consists of (I) 100 pts. wt. polyamide resin using benzoic acid as a terminal blocking agent and 0.01-10 pts. wt. metal oxide and/or metal hydroxide. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006002113(A) 申请公布日期 2006.01.05
申请号 JP20040182440 申请日期 2004.06.21
申请人 KURARAY CO LTD 发明人 MUNESAWA YUJI;YAMASHITA TAKASHI;UCHIDA KOICHI;SUZUKI HIDEAKI
分类号 C08L77/06;C08G69/26;C08K3/00;C08K3/22;C08L101/00 主分类号 C08L77/06
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