发明名称 |
Conductive compound cap layer |
摘要 |
An interconnect structure and method thereof comprising: a interconnect and a compound cap layer. The interconnect has a compound cap layer thereover. The interconnect is preferably comprised of copper. The compound cap layer is preferably comprised of a copper-metal (Cu-Me) compound or a metal; and is more preferably comprised of a Cu-Sn compound or Ni metal. A dielectric cap layer is formed over the compound cap layer. The compound cap layer can provide a barrier capping effect to the Cu to minimize the out-diffusion of Cu and therefore improve the electro-migration performance of Cu. The compound cap layer has excellent adhesion to dielectric cap layers, especially SiN and SiC dielectric cap layers.
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申请公布号 |
US2006001170(A1) |
申请公布日期 |
2006.01.05 |
申请号 |
US20040882855 |
申请日期 |
2004.07.01 |
申请人 |
ZHANG FAN;LEE TAE J;HSIA LIANG CHOO |
发明人 |
ZHANG FAN;LEE TAE J.;HSIA LIANG CHOO |
分类号 |
H01L29/40;H01L21/44 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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